Xiaomi recently launched pro 12 and 12 in China with Snapdragon 8 Gen 1 chipset and the new superior is displayed in the Tearddown video posted by Wikihome on YouTube. Tearardown revealed that the Build 12 Pro was very much “glass sandwich” structurally.
After breaking through the adhesive seal around the glass rear panel, we can see the main board layout and the camera cluster towards the top, the battery in the middle, and the princess board in the lower housing, speaker, and haptic motor.
Many connectors, modules, cameras, and links to the princess’s board need to be removed before the mainboard can come out. Snapdragon 8 Gen 1 Using a Heat Sink movie, copper foil, silicone oil, and a large VC thermal plate measuring 2900 mm sq.
12 Pro is the first smartphone to arrive with the SONY IMX 707 50MP camera sensor and additional camera sensors including Dual 50MP Samsung JN1 dual sensors. The main camera uses a 7-piece lens with OIS while others include telephoto lenses made of 5 pieces and ultrawide 6-piece lenses. The front facing camera is a 32MP shooter.
The RAM and storage module found onboard is produced by SK Hynix with LPDDR5 and UFS 3.1 standards. Teardown also found that the scanner in the display made of a thinner and expensive assembly. Finally, the vibration motor is said to be proportional to the iPhone taptic machine.
Xiaomi 12 Pro also has a 6.73-inch LTPO AMOLED screen. The 4,600 mAh battery is capable of 120W fast charging cable and 50W quick wireless charging.
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